Payment Terms :T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability :136pcs
Delivery Time :3-5 Day
Packaging Details :International Standard Packaging
Category :IC FPGA
Condition :Original 100%,Brand New and Original,New
Series :Stratix III Enhanced
Number of Logic Array Blocks - LABs :3200
Number of I/Os :488 I/O
Package / Case :FBGA-780
Operating Supply Voltage :1.2 V to 3.3 V
Embedded Block RAM - EBR :500 kbit
Service :BOM Kitting
Lead time :In Stock,contact us
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EP3SE80F780C3N Field Programmable Gate Array Stratix III Enhanced
Product Attribute
Attribute Value
Intel
FPGA - Field Programmable Gate Array
Stratix III Enhanced
80000
3200
488 I/O
1.2 V to 3.3 V
0 C
+ 70 C
SMD/SMT
FBGA-780
Tray
Series:
Stratix III
Brand:
Intel / Altera
Embedded Block RAM - EBR:
500 kbit
Moisture Sensitive:
Yes
Product Type:
FPGA - Field Programmable Gate Array
Factory Pack Quantity:
36
Subcategory:
Programmable Logic ICs
Total Memory:
6683 kbit
Tradename:
Stratix
Part # Aliases:
971852
Stratix III devices offer the following features:
■ Support for multiple intellectual property megafunctions from Altera® MegaCore® functions and Altera Megafunction Partners Program (AMPPSM) ■ Support for high-speed networking and communications bus standards including SPI-4.2, SFI-4, SGMII, Utopia IV, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI ■ The only high-density, high-performance FPGA with support for 256-bit AES volatile and non-volatile security key to protect designs ■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters ■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity ■ Programmable Power Technology, which minimizes power while maximizing device performance ■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting ■ Memory interface support with dedicated DQS logic on all I/O banks ■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks
