Payment Terms :T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability :72 pcs
Delivery Time :3-5 Day
Packaging Details :International Standard Packaging
Category :IC FPGA
Condition :Original 100%,Brand New and Original,New
Series :Stratix III Enhanced
Number of Logic Array Blocks - LABs :10200
Number of I/Os :744 I/O
Package / Case :FBGA-1152
Operating Supply Voltage :1.2 V to 3.3 V
Embedded Block RAM - EBR :1594 kbit
Service :BOM Kitting
Lead time :In Stock,contact us
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EP3SE260F1152I3N ALTERA FPGA Chip FBGA-1152 Stratix III Enhanced
Product Attribute
Attribute Value
Intel
FPGA - Field Programmable Gate Array
Stratix III Enhanced
255000
10200
744 I/O
1.2 V to 3.3 V
- 40 C
+ 85 C
SMD/SMT
FBGA-1152
Tray
Series:
Stratix III
Brand:
Intel / Altera
Embedded Block RAM - EBR:
1594 kbit
Moisture Sensitive:
Yes
Product Type:
FPGA - Field Programmable Gate Array
Factory Pack Quantity:
24
Subcategory:
Programmable Logic ICs
Total Memory:
16282 kbit
Tradename:
Stratix
Part # Aliases:
972418
Stratix III devices offer the following features:
■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1) ■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers ■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters ■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity ■ Programmable Power Technology, which minimizes power while maximizing device performance ■ Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation ■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device ■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting ■ Memory interface support with dedicated DQS logic on all I/O banks ■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks
